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Specific Process Knowledge/Wafer cleaning/Post CMP Cleaner: Difference between revisions

Rkch (talk | contribs)
Rkch (talk | contribs)
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*Purpose 3 -->
*Purpose 3 -->
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
 
|style="background:LightGrey; color:black"| 20x20mm substrate
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*Removal rate: 400nm/min
*Thickness accuracy: +/- ? µm
*Thickness homogeneity: +/- ? µm
*Roughness: +/- ? µm
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*Performance range 1
*Performance range 2
*Performance range 3 -->
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|style="background:LightGrey; color:black"|100mm substrate
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*Removal rate: ~ 60 nm/min
*Thickness accuracy: ? µm
*Thickness homogeneity: ? µm
*Roughness: +/- ? µm
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*Performance range -->
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!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameter range