Specific Process Knowledge/Wafer cleaning/Post CMP Cleaner: Difference between revisions
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<!-- give the link to the equipment info page in LabManager: --> | <!-- give the link to the equipment info page in LabManager: --> | ||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=431 The Post CMP Cleaner in LabManager] | [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=431 The Post CMP Cleaner in LabManager] | ||
==Equipment performance and process related parameters== | |||
{| border="2" cellspacing="0" cellpadding="2" | |||
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | |||
|style="background:WhiteSmoke; color:black"|<b>Polisher/Lapper</b> | |||
<!-- |style="background:WhiteSmoke; color:black"|<b>Equipment 2</b> --> | |||
|- | |||
!style="background:silver; color:black;" align="center" width="60"|Purpose | |||
|style="background:LightGrey; color:black"| | |||
Polishing of | |||
|style="background:WhiteSmoke; color:black"| | |||
*Silicon | |||
*SiO2 | |||
<!-- |style="background:WhiteSmoke; color:black"| | |||
*Purpose 1 | |||
*Purpose 2 | |||
*Purpose 3 --> | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | |||
|style="background:LightGrey; color:black"| 20x20mm substrate | |||
|style="background:WhiteSmoke; color:black"| | |||
*Removal rate: 400nm/min | |||
*Thickness accuracy: +/- ? µm | |||
*Thickness homogeneity: +/- ? µm | |||
*Roughness: +/- ? µm | |||
<!-- |style="background:WhiteSmoke; color:black"| | |||
*Performance range 1 | |||
*Performance range 2 | |||
*Performance range 3 --> | |||
|- | |||
|style="background:LightGrey; color:black"|100mm substrate | |||
|style="background:WhiteSmoke; color:black"| | |||
*Removal rate: ~ 60 nm/min | |||
*Thickness accuracy: ? µm | |||
*Thickness homogeneity: ? µm | |||
*Roughness: +/- ? µm | |||
<!-- |style="background:WhiteSmoke; color:black"| | |||
*Performance range --> | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameter range | |||
|style="background:LightGrey; color:black"|Polishing liquid | |||
|style="background:WhiteSmoke; color:black"| | |||
*SF1 Polishing Fluid | |||
|- | |||
|style="background:LightGrey; color:black"|Polishing cloths | |||
|style="background:WhiteSmoke; color:black"| | |||
*Chemcloth Polishing Cloths | |||
|- | |||
|style="background:LightGrey; color:black"|Rotation | |||
|style="background:WhiteSmoke; color:black"| | |||
*Plate | |||
*Head/Puck | |||
|- | |||
|style="background:LightGrey; color:black"|Arm sweep | |||
|style="background:WhiteSmoke; color:black"| | |||
*Polishing: 20% (inner) - 100% (outer) | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Sample size | |||
|style="background:WhiteSmoke; color:black"| | |||
*<nowiki></nowiki> one 20x20mm piece | |||
*one 50 mm wafer | |||
*one 2" wafer | |||
*one 100 mm wafer | |||
*one 150 mm wafer | |||
<!-- |style="background:WhiteSmoke; color:black"| | |||
*<nowiki>#</nowiki> small samples | |||
*<nowiki>#</nowiki> 50 mm wafers | |||
*<nowiki>#</nowiki> 100 mm wafers | |||
*<nowiki>#</nowiki> 150 mm wafers --> | |||
|- | |||
| style="background:LightGrey; color:black"|Allowed materials | |||
|style="background:WhiteSmoke; color:black"| | |||
*Silicon | |||
*Glass/Quartz | |||
<!-- |style="background:WhiteSmoke; color:black"| | |||
*Allowed material 1 | |||
*Allowed material 2 | |||
*Allowed material 3 --> | |||
|- | |||
|} | |||
<br clear="all" /> | |||