Specific Process Knowledge/Wafer cleaning/Post CMP Cleaner: Difference between revisions
Created page with "'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Waf..." |
|||
| Line 4: | Line 4: | ||
= | == Post CMP Cleaner) == | ||
[[image:Cmp_picture.jpg|400px|right|thumb|The Post CMP CLeaner in cleanroom A-5]] | |||
The post CMP Cleaner is designed for removing slurry residues from polishing wafers. After the Post CMP cleaner is the recommended cleaning tool after using the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Polisher_CMP Polisher CMP]'''. | |||
'''The user manual, user APV, technical information and contact information can be found in LabManager:''' | |||
<!-- remember to remove the type of documents that are not present --> | |||
<!-- give the link to the equipment info page in LabManager: --> | |||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=431 The Post CMP Cleaner in LabManager] | |||
Revision as of 08:23, 21 April 2020
Feedback to this page: click here
Post CMP Cleaner)
The post CMP Cleaner is designed for removing slurry residues from polishing wafers. After the Post CMP cleaner is the recommended cleaning tool after using the Polisher CMP.
The user manual, user APV, technical information and contact information can be found in LabManager: