Specific Process Knowledge/Back-end processing/Polisher CMP: Difference between revisions

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Polisher (CMP)

The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates. After CMP it is recommended to use the Post CMP Cleaner to clean the sample for slurry residues left by the CMP.

The user manual, user APV, technical information and contact information can be found in LabManager:

The Logitech Orbis (CMP) in LabManager

Equipment performance and process related parameters

Equipment		Polisher/Lapper
Purpose	Polishing of	Silicon SiO2
Performance	20x20mm substrate	Removal rate: 400nm/min Thickness accuracy: +/- ? µm Thickness homogeneity: +/- ? µm Roughness: +/- ? µm
Performance	100mm substrate	Removal rate: ~ 60 nm/min Thickness accuracy: ? µm Thickness homogeneity: ? µm Roughness: +/- ? µm
Process parameter range	Polishing liquid	SF1 Polishing Fluid
	Polishing cloths	Chemcloth Polishing Cloths
	Rotation	Plate Head/Puck
	Arm sweep	Polishing: 20% (inner) - 100% (outer)
Substrates	Sample size	one 20x20mm piece one 50 mm wafer one 2" wafer one 100 mm wafer one 150 mm wafer
	Allowed materials	Silicon Glass/Quartz

Revision as of 11:48, 1 February 2019 view source Choi (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, danchip 641 edits →‎Polisher (CMP) ← Older edit		Revision as of 08:14, 21 April 2020 view source Rkch (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 271 edits →‎Polisher (CMP) Newer edit →
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	[[image:Cmp_picture.jpg\|400px\|right\|thumb\|The Logitech PM5 Polisher/Lapper in cleanroom A-5]]		[[image:Cmp_picture.jpg\|400px\|right\|thumb\|The Logitech PM5 Polisher/Lapper in cleanroom A-5]]

	The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates.		The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates. After CMP it is recommended to use the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning/Post_CMP_Cleaner Post CMP Cleaner]''' to clean the sample for slurry residues left by the CMP.