Specific Process Knowledge/Back-end processing/LatticeAxe: Difference between revisions
Appearance
No edit summary |
No edit summary |
||
| Line 1: | Line 1: | ||
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/LatticeAxe click here]''' | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/LatticeAxe click here]''' | ||
The Cleaver: LatticeAxe | The Cleaver: LatticeAxe is designed for cleaving wafers into smaller pieces without leaving any particles on the sample. It works by making a small mark in the side of the sample that is then used as a start point for the cleaving. | ||
The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: lattice axe should always be placed inside Fume hood 5. | The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: lattice axe should always be placed inside Fume hood 5. | ||