Specific Process Knowledge/Back-end processing/FlipScribe: Difference between revisions
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The Flip Scribe can cleave samples from 100mm down to ~10mm, please contact wetchemistry group for more information. | The Flip Scribe can cleave samples from 100mm down to ~10mm, please contact wetchemistry group for more information. | ||
DTU-Nanolab has 3 different types of Cleavers see the Labadviser pages for the [ | DTU-Nanolab has 3 different types of Cleavers see the Labadviser pages for the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/FlexScribe FlexScribe]''' and the '''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/LatticeAxe LatticeAxe]''' for more information. | ||
'''[http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/ | |||
Revision as of 07:46, 21 April 2020
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The Cleaver: FlipScribe is a scriber designed for cleaving/scribing wafers into smaller pieces without leaving any particles on the frontside of the sample. It works be scribing from the backside. The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: Flip Scribe should always be placed inside Fume hood 5.
Approved Materials:
- Si
- Quartz
- Pyrex (Borofloat 33)
- GaAs
- InP
- Sapphire
The Flip Scribe can cleave samples from 100mm down to ~10mm, please contact wetchemistry group for more information.
DTU-Nanolab has 3 different types of Cleavers see the Labadviser pages for the FlexScribe and the LatticeAxe for more information.