Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. We also describe the temperature rise on the wafer during gold deposition, the adhesion layers that can be used for gold deposition, | Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. We also describe the temperature rise on the wafer during gold deposition, the adhesion layers that can be used for gold deposition, the roughness of gold deposited in the Wordentec, and issues with particulates on the gold films in the Temescal and the Wordentec. | ||
== Au deposition == | == Au deposition == | ||
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Work done by Johneph Sukham (@ DTU Fotonik) and Radu Malureanu (@ DTU Fotonik and DTU Nanolab) in 2016-2017. | Work done by Johneph Sukham (@ DTU Fotonik) and Radu Malureanu (@ DTU Fotonik and DTU Nanolab) in 2016-2017. | ||
==Particulates in e-beam evaporated films== | |||
[[File:particulates au film.png|right|thumb|upright=2|Alt=SEM image of a film with droplets ranging in size from a few hundred nanometers to about 1.5 microns.|Au droplets on an Au film (image by Evgeniy Shkondin, Au identified by EDX).]] | |||
We have found that the amount of particulates on the e-beam evaporated films depends on the deposition parameters. Specifically for gold it is hard to avoid tiny gold droplets on the films, but they can be minimized with careful attention to the sweep parameters, cleanliness of the target, etc. | |||
The droplets appear to be inconsequential for many users, for instance if the Au layer is simply used as an electrical contact. However, for some users it is very important, for instance when the exact resistivity of the Au layer is critical. | |||
You can read more about this issue [[Specific_Process_Knowledge/Thin_film_deposition/Temescal#Particulates_on_the_films|here]]. | |||