Specific Process Knowledge/Characterization: Difference between revisions
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*Hydrophobicity measurement | *Hydrophobicity measurement | ||
*Resistivity measurement | *Resistivity measurement | ||
*wafer thickness measurement | |||
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*[[SIMS: Secondary Ion Mass Spectrometry]] | *[[SIMS: Secondary Ion Mass Spectrometry]] | ||
*[[Dektak stylus profiler]] | *[[Dektak stylus profiler]] | ||
* | *Drop shape analyser | ||
*4-point probe | *4-point probe | ||
*Stylus thickness measure |
Revision as of 13:36, 20 September 2007
Choose topic
- Surface imaging
- Topographic measurement
- Stress measurement
- Filmthickness measurement
- Element analysis
- Measurement of optical constants
- Hydrophobicity measurement
- Resistivity measurement
- wafer thickness measurement
Choose equipment
- SEM: Scanning Electron Microscopy
- AFM: Atomic Force Microscopy
- Profiler Tencor
- Optical microscope
- Optical characterization ellipsometer - Filmtek - prismcoupler
- SIMS: Secondary Ion Mass Spectrometry
- Dektak stylus profiler
- Drop shape analyser
- 4-point probe
- Stylus thickness measure