Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 02 processing: Difference between revisions
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Aligner: Maskless 02 offers two autofocus modes; optical or pneumatic. The autofocus mode is selected via the substrate template. The defocus process parameter is used to compensate for offsets between the autofocus mechanism and the focal point of the exposure light, as well as to optimize print quality in different resists and varying thicknesses. | Aligner: Maskless 02 offers two autofocus modes; optical or pneumatic. The autofocus mode is selected via the substrate template. The defocus process parameter is used to compensate for offsets between the autofocus mechanism and the focal point of the exposure light, as well as to optimize print quality in different resists and varying thicknesses. | ||
'''Optical:''' | '''Optical:''' Defocus varies greatly with resist type and thickness, see [[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Process_Parameters|Process Parameters]]. Probably also dependent on substrate. Should work for substrates down to 3x3mm<sup>2</sup>. | ||
'''Pneumatic:''' | '''Pneumatic:''' Defocus is probably similar for resists of similar thickness, and not likely to vary with substrate. For 375nm exposure, the optimum seems to be around -15 to -10 ([[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_02_processing#Large_defocus_range|Large defocus range]]). Substrates must be at least 10x10mm<sup>2</sup> to be successfully loaded, probably larger to successfully print. | ||
==Exposure mode== | ==Exposure mode== | ||