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Specific Process Knowledge/Characterization/Topographic measurement: Difference between revisions

Reet (talk | contribs)
Reet (talk | contribs)
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|Depending on the objective:
|Depending on the objective:
*One view: 127µmX95µm to 1270µmX955µm
*One view: 127µmX95µm to 1270µmX955µm
*Stitching: In principel a hole 6" wafer (time consuming)
*Stitching: In principel a whole 6" wafer (time consuming)
|Only 10x objective: 2.0 mm x 1.7 mm
|Only 10x objective: 2.0 mm x 1.7 mm
|90 µm square
|90 µm square