Specific Process Knowledge/Characterization/Topographic measurement: Difference between revisions

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!
!
![[Specific Process Knowledge/Characterization/Profiler#Dektak_8_stylus_profiler|Dektak 8 stylus profiler]]
![[Specific Process Knowledge/Characterization/Profiler#Dektak_8_stylus_profiler|Dektak 8 stylus profiler]]
![[Specific Process Knowledge/Characterization/Profiler#Dektak XTA_new_stylus_profiler|Dektak XTA_new stylus profiler]]
![[Specific Process Knowledge/Characterization/Profiler#Dektak XTA_new_stylus_profiler|Dektak XTA stylus profiler]]
![[Specific Process Knowledge/Characterization/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]]
![[Specific Process Knowledge/Characterization/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]]
![[Specific Process Knowledge/Characterization/Profiler#Optical_Profiler_(Filmetrics)|Optical Profiler (Filmetrics)]]
![[Specific Process Knowledge/Characterization/Profiler#Optical_Profiler_(Filmetrics)|Optical Profiler (Filmetrics)]]
![[Specific Process Knowledge/Characterization/AFM: Atomic Force Microscopy|AFM Icon 1 and AFM Icon 2]]
![[Specific Process Knowledge/Characterization/AFM: Atomic Force Microscopy|AFM Icon 1 and AFM Icon 2]]
![[Specific Process Knowledge/Characterization/Profiler#Dektak III-V Profiler|Dektak 3ST]]
![[Specific_Process_Knowledge/Characterization/Profiler#Stylus_Profiler:_Dektak150|Dektak 150 stylus profiler]]
![[Specific Process Knowledge/Characterization/Profiler#Dektak III-V Profiler|Dektak 3ST stylus profiler]]
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|3D Profiler for measuring micro structures and surface roughness. Can do wafer mapping. Positioned in the basement.
|3D Profiler for measuring micro structures and surface roughness. Can do wafer mapping. Positioned in the basement.
|AFM for measuring nanostructures and surface roughness
|AFM for measuring nanostructures and surface roughness
|Profiler for measuring micro structures.
|Profiler for measuring micro structures.
|Profiler for measuring micro structures.
|-
|-
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|90 µm square
|90 µm square
|Line scan x: 50-50000 µm  
|Line scan x: 50-50000 µm  
|Line scan x: 50-55000 µm
|-
|-


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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!'''Max. scan range z'''
!'''Max. scan range z'''
|50Å to 1mm
|50 Å to 1 mm
|50Å to 1mm
|50 Å to 1 mm
|Depending on the objective and Z resolution:
|Depending on the objective and Z resolution:
*94.4 µm ->9984 µm
*94.4 µm ->9984 µm
|10 mm (piezo range 500 µm)
|10 mm (piezo range 500 µm)
|1 µm (can go up to 5 µm under special settings)
|1 µm (can go up to 5 µm under special settings)
|130 nm
|100 Å to 130 nm
|50 Å to 1 mm
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
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|Depending on scan size and number of samples per line and number of lines - accuracy better than 2%
|Depending on scan size and number of samples per line and number of lines - accuracy better than 2%
| 
| 
|down to 0.003 µm
|-
|-


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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!'''Resolution z'''
!'''Resolution z'''
|, 10Å, 40Å or 160Å
|1 Å, 10 Å, 40 Å or 160 Å depending on range
|, 10Å, 80Å or 160Å
|1 Å, 10 Å, 40 Å or 160 Å depending on range
|Depending on measuring methode:
|Depending on measuring methode:
*PSI down to 0.01 nm
*PSI down to 0.01 nm
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*Precision 0.1%
*Precision 0.1%
|<1Å - accuracy better than 2%
|<1Å - accuracy better than 2%
|&nbsp;
|1 Å, 10 Å or 20 Å depending on range
|1 Å, 10 Å, 40 Å or 160 Å depending on range
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!'''Max. scan depth [µm] (as a function of trench width W''')
!'''Max. scan depth [µm] as a function of trench width W''')
|1.2*(W[µm]-5µm)
|1.2*(W[µm]-5µm)
|1.2*(W[µm]-5µm)
|1.2*(W[µm]-5µm)
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|Depending on material and trench width.
|Depending on material and trench width.
|~1:1 with standard cantilever.
|~1:1 with standard cantilever.
|&nbsp;
|1.2*(W[µm]-2.5µm)
|1.2*(W[µm]-5µm)
|-
|-


|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!'''Tip radius'''
!'''Standard tip radius'''
|5 µm 45<sup>o</sup> cone
|5 µm 45<sup>o</sup> cone
|5 µm 45<sup>o</sup> cone
|5 µm 45<sup>o</sup> cone
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*White broadband LED: 550nm
*White broadband LED: 550nm
|<12 nm on standard cantilever
|<12 nm on standard cantilever
|&nbsp;
|2.5 µm 45<sup>o</sup> cone
|5 µm 45<sup>o</sup> cone
|-
|-


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|Can be done
|Can be done
|No stress calculation capability
|No stress calculation capability
|Cannot be done
|Cannot be done
|Cannot be done
|Cannot be done
|Cannot be done
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|Can be done on a selected surface area  
|Can be done on a selected surface area  
|Recommended to use Dektak XTA or Dektak 8.
|Recommended to use Dektak XTA or Dektak 8.
|Can be done on a line scan
|-
|-


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|6" or less
|6" or less
|4" or less
|4" or less
|up to 6"
|-
|-


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|
|
*Almost any material that does not leave residual on the stage, please check the responsible group for any non standard materials
*Almost any material that does not leave residual on the stage, please check the responsible group for any non standard materials
|
*Almost any material that does not leave residual on the stage.
|
|
*Almost any material that does not leave residual on the stage.
*Almost any material that does not leave residual on the stage.
|-
|-
|}
|}

Revision as of 13:02, 15 April 2020

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Topographic measurements are measurements were you can measure hight differences on your substrate. If you measure in many spots of the substrate you can get a topographic image of the substrate.

At DTU Nanolab we have five systems for topographic measurements:

  • Dektak stylus profilers (Dektak XTA, Dektak 3ST and Dektak 8) - Profiler for measuring micro structures
  • Optical Profiler (Sensofar) - 3D Profiler for measuring micro structures
  • Nanoman - AFM for measuring nano structures

High Aspect ratio structures
The fact that the tips of the Dektak profilers and the AFM are shaped like a cone with some tip angle causes a problem when characterizing high aspect ratio structures. For instance, if a 20 µm wide trench is etched deeper than approximately 18 µm, the tip of the Dektak will not be able to reach the bottom. The optical profiler uses a light beam that is focused through an objective. Therefore it is able to measure higher aspect ratios. The aspect ratio is limited by the possibility for the light to reach the bottom and get back to the detector. On some samples we have been able to measure aspect ratios above 1:10. Otherwise the solution is to cleave the sample along a line that is perpendicular to the trench and then inspect the profile in a scanning electron microscope or a microscope (for large structures).


Comparison of the two stylus profilers, the optical profiler and the AFM

Dektak 8 stylus profiler Dektak XTA stylus profiler Optical Profiler (Sensofar) Optical Profiler (Filmetrics) AFM Icon 1 and AFM Icon 2 Dektak 150 stylus profiler Dektak 3ST stylus profiler
Generel description Profiler for measuring micro structures. Can do wafer mapping and stress measurements. Profiler for measuring micro structures. Can do wafer mapping and stress measurements. 3D Profiler for measuring micro structures and surface roughness. Can do wafer mapping. 3D Profiler for measuring micro structures and surface roughness. Can do wafer mapping. Positioned in the basement. AFM for measuring nanostructures and surface roughness Profiler for measuring micro structures. Profiler for measuring micro structures.
Max. scan range xy Line scan x: 50µm to 200mm Line scan x: 50µm to 55mm in one scan. Maximum scan lenght with stiching 200mm. Depending on the objective:
  • One view: 127µmX95µm to 1270µmX955µm
  • Stitching: In principel a hole 6" wafer (time consuming)
Only 10x objective: 2.0 mm x 1.7 mm 90 µm square Line scan x: 50-50000 µm Line scan x: 50-55000 µm
Max. scan range z 50 Å to 1 mm 50 Å to 1 mm Depending on the objective and Z resolution:
  • 94.4 µm ->9984 µm
10 mm (piezo range 500 µm) 1 µm (can go up to 5 µm under special settings) 100 Å to 130 nm 50 Å to 1 mm
Resolution xy down to 0.067 µm down to 0.003 µm Depending on the objective:
  • 0.5µm -> 5µm
Resolving power og the lense: 0.92 µm Depending on scan size and number of samples per line and number of lines - accuracy better than 2%   down to 0.003 µm
Resolution z 1 Å, 10 Å, 40 Å or 160 Å depending on range 1 Å, 10 Å, 40 Å or 160 Å depending on range Depending on measuring methode:
  • PSI down to 0.01 nm
  • VSI down to 1 nm
  • Confocal (depending on objective): 1nm -> 50nm
  • Accuracy 0.7%
  • Precision 0.1%
<1Å - accuracy better than 2% 1 Å, 10 Å or 20 Å depending on range 1 Å, 10 Å, 40 Å or 160 Å depending on range
Max. scan depth [µm] as a function of trench width W) 1.2*(W[µm]-5µm) 1.2*(W[µm]-5µm) Depending on material and trench width:
  • Somewhere between 1:1 and 1:12
Depending on material and trench width. ~1:1 with standard cantilever. 1.2*(W[µm]-2.5µm) 1.2*(W[µm]-5µm)
Standard tip radius 5 µm 45o cone 5 µm 45o cone No tip - using light
  • Blue monochromatic LED: 460nm
  • White broadband LED: 550nm
No tip - using light
  • Blue monochromatic LED: 460nm
  • White broadband LED: 550nm
<12 nm on standard cantilever 2.5 µm 45o cone 5 µm 45o cone
Stress measurement Can be done Can be done No stress calculation capability Cannot be done Cannot be done Cannot be done Cannot be done
Surface roughness Can be done on a line scan Can be done on a line scan Can be done on a line or an area Can be done on a line or an area Can be done on a selected surface area Recommended to use Dektak XTA or Dektak 8. Can be done on a line scan
Substrate size up to 8" up to 6" Up to more than 6" 100x100 mm 6" or less 4" or less up to 6"
Allowed materials
  • Almost any material that does not leave residual on the stage, please check the responsible group for any non standard materials
  • Almost any material that does not leave residual on the stage, please check the responsible group for any non standard materials
  • Almost any material that does not leave residual on the stage, please check the responsible group for any non standard materials
  • Almost any material that does not leave residual on the stage, please check the responsible group for any non standard materials
  • Almost any material that does not leave residual on the stage, please check the responsible group for any non standard materials
  • Almost any material that does not leave residual on the stage.
  • Almost any material that does not leave residual on the stage.