Specific Process Knowledge/Thin film deposition/Deposition of Titanium Nitride: Difference between revisions
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Thin films of titanium nitride can only be deposited in the [[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)|ALD2]] at the moment. More information about the process can be found [[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)/TiN deposition using ALD2|here]]. | Thin films of titanium nitride can only be deposited in the [[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)|ALD2]] at the moment. More information about the process can be found [[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)/TiN deposition using ALD2|here]]. | ||
== | ==Comparison between sputtering and ALD methods for deposition of Titanium nitride.== | ||
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" | {|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" | ||
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![[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)|ALD2]] | ![[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)|ALD2]] | ||
![[Specific Process Knowledge/Thin film deposition/Lesker|Sputter System Lesker]] | |||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Generel description | !Generel description | ||
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*Atomic Layer Deposition | *Atomic Layer Deposition | ||
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*Sputtering | |||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Stoichiometry | !Stoichiometry | ||
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*TiN | *TiN | ||
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*TiN (can be tuned) | |||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Film Thickness | !Film Thickness | ||
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* 0nm - 50nm | * 0nm - 50nm | ||
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* 0nm - 200nm | |||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Deposition rate | !Deposition rate | ||
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* 0.0173 nm/cycle on a flat sample | * 0.0173 nm/cycle on a flat sample | ||
* 0.0232 nm/cycle on a high aspect ratio structures | * 0.0232 nm/cycle on a high aspect ratio structures | ||
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* up to 0.0625 nm/s on a flat sample | |||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Step coverage | !Step coverage | ||
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*Very good | *Very good | ||
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*Not investigated | |||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Process Temperature | !Process Temperature | ||
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* 450<sup>o</sup>C | * 450<sup>o</sup>C | ||
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* 400<sup>o</sup>C | |||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Substrate size | !Substrate size | ||
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*1-5 100 mm wafers | *1-5 100 mm wafers | ||
*1-5 150 mm wafer | *1-5 150 mm wafer | ||
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*Several small samples | |||
*100 mm wafer | |||
*150 mm wafer | |||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!'''Allowed materials''' | !'''Allowed materials''' | ||
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*III-V materials (use dedicated carrier wafer) | *III-V materials (use dedicated carrier wafer) | ||
*Polymers (depending on the melting point/deposition temperature, use carrier wafer) | *Polymers (depending on the melting point/deposition temperature, use carrier wafer) | ||
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*Silicon | |||
*Silicon oxide, silicon nitride | |||
*Quartz/fused silica | |||
*Metals | |||
*III-V materials (use dedicated carrier wafer) | |||
*Almost anything that is not toxic. | |||
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|} | |} |
Revision as of 14:28, 6 April 2020
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Deposition of Titanium nitride
Thin films of titanium nitride can only be deposited in the ALD2 at the moment. More information about the process can be found here.
Comparison between sputtering and ALD methods for deposition of Titanium nitride.
ALD2 | Sputter System Lesker | |
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Generel description |
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Stoichiometry |
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Film Thickness |
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Deposition rate |
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Step coverage |
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Process Temperature |
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Substrate size |
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Allowed materials |
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