Specific Process Knowledge/Thin film deposition: Difference between revisions
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[[/Deposition of Silicon Oxide|Silicon Oxide]]<br/> | [[/Deposition of Silicon Oxide|Silicon Oxide (SiO<sub>2</sub>)]]<br/> | ||
[[/Deposition of Titanium Oxide| | [[/Deposition of Titanium Oxide|Titanium Oxide (TiO<sub>2</sub>)]]<br/> | ||
[[/Deposition of Alumina| | [[/Deposition of Alumina|Aluminium Oxide (Al<sub>2</sub>O<sub>3</sub>)]]<br/> | ||
[[/Lesker|Tantalum (Ta<sub>2</sub>O<sub>5</sub> | [[/Lesker|Tantalum Oxide (Ta<sub>2</sub>O<sub>5</sub>)]]<br/> | ||
[[/Lesker| | [[/Lesker|Chromium Oxide (Cr<sub>2</sub>O<sub>3</sub>)]]<br/> | ||
[[/Deposition of Hafnium Oxide|Hafnium Oxide]]<br/> | [[/Deposition of Hafnium Oxide|Hafnium Oxide (HfO<sub>2</sub>)]]<br/> | ||
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[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/> | [[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/> | ||
[[/Deposition of Titanium Nitride|Titanium Nitride]] - '' | [[/Deposition of Titanium Nitride|Titanium Nitride]] - ''conductive ceramics'' <br/> | ||
[[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/> | [[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/> | ||
Revision as of 13:17, 6 April 2020
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Choose material to deposit
Dielectrica | Semicondutors | Metals | Nitrides | Alloys | Transparent conductive oxides | Polymers |
Silicon Oxide (SiO2) |
Aluminium
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Silicon Nitride - and oxynitride
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TiW alloy (10%/90% by weight) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Choose deposition equipment
PVD | LPCVD | PECVD | ALD | Coaters | Others
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See the Lithography/Coaters page for coating polymers |
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