Specific Process Knowledge/Back-end processing/FlipScribe: Difference between revisions
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The Cleaver: FlipScribe is designed for cleaving wafers into smaller pieces without leaving any particles on the frontside of the sample. It works be scribing from the backside. The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: Flip Scribe should always be placed inside Fume hood 5. | The Cleaver: FlipScribe is designed for cleaving wafers into smaller pieces without leaving any particles on the frontside of the sample. It works be scribing from the backside. The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: Flip Scribe should always be placed inside Fume hood 5. | ||
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'''Approved Materials''': | '''Approved Materials''': | ||
Revision as of 14:35, 31 March 2020
The Cleaver: FlipScribe is designed for cleaving wafers into smaller pieces without leaving any particles on the frontside of the sample. It works be scribing from the backside. The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: Flip Scribe should always be placed inside Fume hood 5.
Approved Materials:
- Si
- Quartz
- Pyrex (Borofloat 33)
- GaAs
- InP
- Sapphire
The Flip Scribe can cleave samples from 100mm down to ~10mm, please contact wetchemistry group for more information