Specific Process Knowledge/Back-end processing/LatticeAxe: Difference between revisions
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'''Approved Materials''': | '''Approved Materials''': | ||
Si | |||
Quartz | *Si | ||
Pyrex (Borofloat 33) | *Quartz | ||
GaAs | *Pyrex (Borofloat 33) | ||
InP | *GaAs | ||
Sapphire | *InP | ||
*Sapphire | |||
Revision as of 14:01, 31 March 2020
The Cleaver: Lattice Axe is designed for cleaving wafers into smaller pieces. The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: lattice axe should always be placed inside Fume hood 5.
Approved Materials:
- Si
- Quartz
- Pyrex (Borofloat 33)
- GaAs
- InP
- Sapphire