Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions
m →Sputtering of TiW: added link to grain size study |
|||
Line 7: | Line 7: | ||
*[[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]] | *[[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]] | ||
*[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]] | *[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]] | ||
{| border="1" cellspacing="0" cellpadding="4" | {| border="1" cellspacing="0" cellpadding="4" |
Revision as of 15:43, 27 March 2020
Feedback to this page: click here
Sputtering of TiW
Deposition of TiW alloy can be done in the Wordentec. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).
- Sputtering of TiW in Wordentec
- Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec
Sputter deposition (Wordentec) | |
---|---|
General description | Sputter deposition of TiW |
Pre-clean | RF Ar clean |
Layer thickness | . |
Deposition rate | Depending on process parameters, see here. |
Batch size |
|
Allowed substrates |
|
Allowed materials |
|
Comments | TiW alloy: 10%/90% by weight |