Specific Process Knowledge/Etch/DRIE-Pegasus/System-description: Difference between revisions
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# '''Ramping''':Using the ramp option one can change process parameters linearly over the course of each processing step. | # '''Ramping''':Using the ramp option one can change process parameters linearly over the course of each processing step. | ||
# '''Process steps''': Stich any number of processing steps with different parameters to make one continuous process. | # '''Process steps''': Stich any number of processing steps with different parameters to make one continuous process. | ||
# '''Hardware''': The Pegasus has several hardware settings | # '''Hardware''': The Pegasus has several hardware settings that can be changed - you will, however, need a very strong argument to come through with a request for such a changed as it will also change processing conditions for all other processes. | ||
## ''Spacers '': The distance to the plasma source may be changed by using different spacers. | ## ''Spacers '': The distance to the plasma source may be changed by using different spacers. | ||
## ''Baffle and funnel'': The funnel inside the chamber helps to focus the plasma/ions towards the electrode. They may be taken out but don't expect this option to be part of the parameters that you can change in your experiments. | ## ''Baffle and funnel'': The funnel inside the chamber helps to focus the plasma/ions towards the electrode. They may be taken out but don't expect this option to be part of the parameters that you can change in your experiments. | ||