Specific Process Knowledge/Etch/DRIE-Pegasus/System-description: Difference between revisions
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In the continuous processes (that means fixed parameters that do not change during the process) that are used in most dry etch tools the action of the impedance matching network is mostly seen in the beginning of the process when the plasma stabilizes. Once stabilized and a minimum reflected power has been established, the capacitors usually needs only minor adjustments. Below is a datalog of an oxygen cleaning process running with: | In the continuous processes (that means fixed parameters that do not change during the process) that are used in most dry etch tools the action of the impedance matching network is mostly seen in the beginning of the process when the plasma stabilizes. Once stabilized and a minimum reflected power has been established, the capacitors usually needs only minor adjustments. Below is a datalog of an oxygen cleaning process running with: | ||
* 100 sccm | * 100 sccm O<sub>2</sub> | ||
* 1200 W coil power | * 1200 W coil power | ||
* 20 W platen power | * 20 W platen power | ||