LabAdviser/314/Preparation 314-307/Solid-matter/FIB-lamella: Difference between revisions

fig 1. The first layer is deposited using the electron beam to minimize surface damage from the subsequent ion beam deposition, imaging and milling. The deposition is done by exposing the sample to a precursor of metal organic gas and scanning the electron beam over the area where deposition is desired. This causes the gas molecules to decompose and parts of the decomposed products deposit on the surface. The electron beam settings used for the deposition are high tension (HT) of 2-5kV with a high current 5.5nA. The deposition thickness listed in the sketch are approximate numbers and are sample dependent. Remember to insert and heat the Pt GIS prior to choose “Pt ebeam structure” for the Pt deposition with the electron beam and the “Pt dep” for deposition with the ion beam.  The reason for even having an ion beam deposition afterwards is that the ion beam leaves a much thicker deposition within a reasonable time which protects against the ion beam in the following steps. There is a clear risk of damaging the surface during both depositions. The HT and current used for the ion beam assisted deposition is 30kV and 0.26nA.