Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions
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==Film quality optimization== | ==Film quality optimization== | ||
''By Bjarke Thomas Dalslet @Nanotech.dtu.dk'' | ''By Bjarke Thomas Dalslet @Nanotech.dtu.dk'' | ||
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|Ni80Fe20||Permalloy||High||0.80 | |Ni80Fe20||Permalloy||High||0.80 | ||
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==Overview of the performance of Sputter-System(Lesker) and some process related parameters== | |||
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!style="background:silver; color:black;" align="left"|Purpose | |||
|style="background:LightGrey; color:black"|Deposition of magnetic metals and dielectrica ||style="background:WhiteSmoke; color:black"| | |||
*Sputtering of magnetic metals and Silicon | |||
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!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Performance | |||
|style="background:LightGrey; color:black"|Film thickness||style="background:WhiteSmoke; color:black"| | |||
*Material dependent but generally up to hundreds of nm | |||
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|style="background:LightGrey; color:black"|Deposition rates | |||
|style="background:WhiteSmoke; color:black"| | |||
*See [[#Relative Sputter rates |table]] below | |||
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!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Process parameter range | |||
|style="background:LightGrey; color:black"|Process Temperature | |||
|style="background:WhiteSmoke; color:black"| | |||
* usually room temp | |||
* Sample can be heated to more than 400°C * | |||
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|style="background:LightGrey; color:black"|Process pressure | |||
|style="background:WhiteSmoke; color:black"| | |||
*3-10 mTorr | |||
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|style="background:LightGrey; color:black"|Process Gases | |||
|style="background:WhiteSmoke; color:black"| | |||
*Ar | |||
*N<math>_2</math> | |||
*O<math>_2</math> | |||
*2%O<math>_2</math> in Ar | |||
* mixtures of the above | |||
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!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Batch size | |||
|style="background:WhiteSmoke; color:black"| | |||
*chips | |||
*4" | |||
*6" | |||
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| style="background:LightGrey; color:black"|Substrate material allowed | |||
|style="background:WhiteSmoke; color:black"| | |||
*Silicon wafers | |||
*and almost any other | |||
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| style="background:LightGrey; color:black"|Material allowed on the substrate | |||
|style="background:WhiteSmoke; color:black"| | |||
*almost any | |||
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''*'' For temperatures above 400°C, please contact thinfilm@danchip.dtu.dk, as higher temperatures may damage the machine. | |||