Specific Process Knowledge/Thin film deposition/Deposition of NiFe: Difference between revisions
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=Deposition of NiFe alloy= | =Deposition of NiFe alloy= | ||
NiFe has been deposited in the [[Specific_Process_Knowledge/Thin_film_deposition/Lesker|Sputter System (Lesker)]] here at Nanolab. | NiFe has been deposited in the [[Specific_Process_Knowledge/Thin_film_deposition/Lesker|Sputter System (Lesker)]] here at Nanolab. | ||
You will find information on the pressure, max power and expected deposition rate [http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Lesker#List_of_available_targets_for_the_Sputter-System.28Lesker.29_.2803_June_2013.29 here] in LabAdviser. | |||
To see all the deposition parameters used in that machine by others, search the [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&machid=244 Process Log] in LabManager. | |||
Below you will find some results on optimizing the film crystalline quality for NiFe by Bjarke Thomas Dalslet. Bjarke also investigated the surface roughness of NiFe as a function of change in the substrate bias, but found little variation. | |||
==Film quality optimization== | ==Film quality optimization== | ||