Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide/Deposition of Silicon Oxide using Lesker sputter tool: Difference between revisions
| Line 3: | Line 3: | ||
=Sputter deposition of SiO<sub>2</sub> using Sputter System (Lesker)= | =Sputter deposition of SiO<sub>2</sub> using Sputter System (Lesker)= | ||
SiO<sub>2</sub> can be sputter deposited with RF bias in the [[Specific_Process_Knowledge/Thin_film_deposition/Lesker|Sputter System (Lesker)]]. You can see the deposition parameters used by others in the [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&machid=244 Process Log] in LabManager. Below you will find | SiO<sub>2</sub> can be sputter deposited with RF bias in the [[Specific_Process_Knowledge/Thin_film_deposition/Lesker|Sputter System (Lesker)]]. You can see the deposition parameters used by others in the [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&machid=244 Process Log] in LabManager. Below you will find deposition parameters and results of studies on the stress and surface roughness of the deposited films. | ||
==Surface roughness optimization== | ==Surface roughness optimization== | ||