Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
Appearance
| Line 3: | Line 3: | ||
== Deposition of Cu == | == Deposition of Cu == | ||
Copper can be deposited by e-beam evaporation, sputtering or electroplating. In the chart below you can compare the different deposition | Copper can be deposited by e-beam evaporation, sputtering or electroplating. In the chart below you can compare the different deposition equipment. | ||