Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Leybold|Leybold]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Leybold|Leybold]]) | ||
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/ | ! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
|- | |- | ||
| Batch size | | Batch size | ||
Revision as of 10:39, 9 February 2009
Silver can be deposited by e-beam or thermal evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | Thermal evaporation (Wordentec) | |
|---|---|---|---|
| Batch size |
|
|
|
| Pre-clean | RF Ar clean | Ar ion bombartment | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 0.5µm | 10Å to 0.5µm (0.5µm not on all wafers) |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 5Å/s | 1Å to 10 Å/s |
Thermal deposition of Silver - Process settings for thermal deposition of Silver in Wordentec