Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions
Appearance
| Line 34: | Line 34: | ||
In the graphs below the HfO<sub>2</sub> thickness vs. number of cycles for deposition temperatures between 150 <sup>o</sup>C and 350 <sup>o</sup>C presented. Results have been obtained for <100> 150 mm Si wafers with native oxide, based on ellipsometry study. | In the graphs below the HfO<sub>2</sub> thickness vs. number of cycles for deposition temperatures between 150 <sup>o</sup>C and 350 <sup>o</sup>C presented. Results have been obtained for <100> 150 mm Si wafers with native oxide, based on ellipsometry study. | ||
<gallery caption=" | <gallery caption="System set-up and power supply configuration." widths="1000px" heights="600px" perrow="1"> | ||
image:Kaempe_Lesker_image_overview_main.png| Deposition rate of HfO<sub>2</sub> at 150 <sup>o</sup>C. Substrate: Silicon 6" wafer with native oxide. | image:Kaempe_Lesker_image_overview_main.png| Deposition rate of HfO<sub>2</sub> at 150 <sup>o</sup>C. Substrate: Silicon 6" wafer with native oxide. | ||
</gallery> | </gallery> | ||