Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions
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=Process information= | =Process information= | ||
{| border="2" cellspacing="0" cellpadding="9" | |||
!colspan="1" border="none" style="background:silver; color:black;" align="center"|Target size | |||
|style="background:silver; color:black"|<b>Target material</b> | |||
|style="background:silver; color:black"|<b>Maximum Power density (W/inch<sup>2</sup>)</b> | |||
|style="background:silver; color:black"|<b>Maximum Power (W)</b> | |||
|style="background:silver; color:black"|<b>Maximum Ramp up/down Power (W/s)</b> | |||
|style="background:silver; color:black"|<b>Comments</b> | |||
|- | |||
!style="background:silver; color:black;" align="center" rowspan="12"|3 inch | |||
|style="background:LightGrey; color:black" align="center"|<b>Al</b> | |||
|style="background:WhiteSmoke; color:black" align="center"|150 | |||
|style="background:WhiteSmoke; color:black" align="center"|1000 | |||
|style="background:WhiteSmoke; color:black" align="center"|10 | |||
|style="background:WhiteSmoke; color:black" align="center"|DC/HiPIMS | |||
|- | |||
!style="background:LightGrey; color:black" align="center" valign="center"|Au | |||
|style="background:WhiteSmoke; color:black" align="center"|100 | |||
|style="background:WhiteSmoke; color:black" align="center"|700 | |||
|style="background:WhiteSmoke; color:black" align="center"|10 | |||
|style="background:WhiteSmoke; color:black" align="center"|DC/HiPIMS | |||
|- | |||
!style="background:LightGrey; color:black" align="center" valign="center"|Ag | |||
|style="background:WhiteSmoke; color:black" align="center"|100 | |||
|style="background:WhiteSmoke; color:black" align="center"|700 | |||
|style="background:WhiteSmoke; color:black" align="center"|10 | |||
|style="background:WhiteSmoke; color:black" align="center"|DC/HiPIMS | |||
|- | |||
!style="background:LightGrey; color:black" align="center" valign="center"|Cu | |||
|style="background:WhiteSmoke; color:black" align="center"|200 | |||
|style="background:WhiteSmoke; color:black" align="center"|1400 | |||
|style="background:WhiteSmoke; color:black" align="center"|10 | |||
|style="background:WhiteSmoke; color:black" align="center"|DC/HiPIMS | |||
|- | |||
!style="background:LightGrey; color:black" align="center" valign="center"|Ni | |||
|style="background:WhiteSmoke; color:black" align="center"|50 | |||
|style="background:WhiteSmoke; color:black" align="center"|350 | |||
|style="background:WhiteSmoke; color:black" align="center"|10 | |||
|style="background:WhiteSmoke; color:black" align="center"|High strengh magnets/DC | |||
|- | |||
!style="background:LightGrey; color:black" align="center" valign="center"|Ti | |||
|style="background:WhiteSmoke; color:black" align="center"|50 | |||
|style="background:WhiteSmoke; color:black" align="center"|350 | |||
|style="background:WhiteSmoke; color:black" align="center"|10 | |||
|style="background:WhiteSmoke; color:black" align="center"|DC/HiPIMS | |||
|- | |||
!style="background:LightGrey; color:black" align="center" valign="center"|Ge (Bonded) | |||
|style="background:WhiteSmoke; color:black" align="center"|20 | |||
|style="background:WhiteSmoke; color:black" align="center"|140 | |||
|style="background:WhiteSmoke; color:black" align="center"|0.3 | |||
|style="background:WhiteSmoke; color:black" align="center"|DC/RF | |||
|- | |||
!style="background:LightGrey; color:black" align="center" valign="center"|Si (Unbonded/Bonded) | |||
|style="background:WhiteSmoke; color:black" align="center"|20 | |||
|style="background:WhiteSmoke; color:black" align="center"|140 | |||
|style="background:WhiteSmoke; color:black" align="center"|0.3 | |||
|style="background:WhiteSmoke; color:black" align="center"|RF | |||
|- | |||
!style="background:LightGrey; color:black" align="center" valign="center"|SiO<sub>2</sub> (Bonded) | |||
|style="background:WhiteSmoke; color:black" align="center"|20 | |||
|style="background:WhiteSmoke; color:black" align="center"|140 | |||
|style="background:WhiteSmoke; color:black" align="center"|0.3 | |||
|style="background:WhiteSmoke; color:black" align="center"|RF | |||
|- | |||
!style="background:LightGrey; color:black" align="center" valign="center"|ITO (Bonded) | |||
|style="background:WhiteSmoke; color:black" align="center"|20 | |||
|style="background:WhiteSmoke; color:black" align="center"|140 | |||
|style="background:WhiteSmoke; color:black" align="center"|0.3 | |||
|style="background:WhiteSmoke; color:black" align="center"|RF/PDC | |||
|- | |||
!style="background:LightGrey; color:black" align="center" valign="center"|BaTiO<sub>3</sub> (Bonded) | |||
|style="background:WhiteSmoke; color:black" align="center"|20 | |||
|style="background:WhiteSmoke; color:black" align="center"|140 | |||
|style="background:WhiteSmoke; color:black" align="center"|0.3 | |||
|style="background:WhiteSmoke; color:black" align="center"|RF | |||
|- | |||
!style="background:LightGrey; color:black" align="center" valign="center"|NbTi | |||
|style="background:WhiteSmoke; color:black" align="center"|50 | |||
|style="background:WhiteSmoke; color:black" align="center"|350 | |||
|style="background:WhiteSmoke; color:black" align="center"|10 | |||
|style="background:WhiteSmoke; color:black" align="center"|DC | |||
|- | |||
!style="background:silver; color:black;" align="center" rowspan="12"|4 inch | |||
|style="background:LightGrey; color:black" align="center"|<b>Al<b> | |||
|style="background:WhiteSmoke; color:black" align="center"|150 | |||
|style="background:WhiteSmoke; color:black" align="center"|1800 | |||
|style="background:WhiteSmoke; color:black" align="center"|10 | |||
|style="background:WhiteSmoke; color:black" align="center"|DC/HiPIMS | |||
|- | |||
|} | |||
There are in total 76 developed and tested process recipes for general users (48 for PC1 and 28 for PC3). Starting the recipe the user can change te relevant process parameters: power, pressure, reactive gas ratio, rotation speed, substrate bias etc. In addition to the process recipes, there are also recipes for substrate heating and RF cleaning. | There are in total 76 developed and tested process recipes for general users (48 for PC1 and 28 for PC3). Starting the recipe the user can change te relevant process parameters: power, pressure, reactive gas ratio, rotation speed, substrate bias etc. In addition to the process recipes, there are also recipes for substrate heating and RF cleaning. | ||