Specific Process Knowledge/Thin film deposition: Difference between revisions

Revision as of 10:22, 21 March 2020

3rd Level - Material/Method

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Dielectrica	Semicondutors	Metals	Alloys	Transparent conductive oxides	Polymers
Silicon Nitride - and oxynitride Silicon Oxide Titania (TiO₂, Titanium Oxide) Alumina (Al₂O₃, Aluminium Oxide) Aluminum Nitride (Al_xN_y) Tantalum (Ta₂O₅, Tantalum pentoxide) Cromia (Cr₂O₃, Chromium Oxide) Hafnium Oxide Titanium Nitride - ceramic	Silicon Germanium Zinc Oxide (ZnO)	Aluminium Chromium Cobalt Copper Gold Iron Magnesium Molybdenum Nickel Niobium Palladium Platinum Ruthenium Silver Tantalum Tin Titanium Tungsten Zinc	TiW alloy (10%/90% by weight) NiV alloy AlCu CoFe CuTi FeMn MnIr NiCo NiFe YSZ (Yttrium stabilized Zirconium)	ITO (Tin doped Indium Oxide) AZO (Aluminum doped Zinc Oxide)	SU-8 Antistiction coating Topas PMMA

PVD

LPCVD

PECVD

ALD

Coaters

Others

Sputter-System Metal-Oxide(PC1) - Cluster-based multi-chamber high vacuum sputtering deposition system

Lesker - Sputter tool
Wordentec - E-beam evaporator, sputter and thermal evaporator
Thermal evaporator
E Beam Evaporator (Temescal)
Physimeca - E-beam evaporator
IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching
Sputter coater 03 - Gold sputtering system
Sputter coater 04 - Gold sputtering system

See the Lithography/Coaters page for coating polymers

MVD - Molecular Vapor Deposition
Electroplating-Ni - Electrochemical deposition of nickel
Electroplating-Cu - Electrochemical deposition of copper
MOCVD - Epitaxial growth - Ask the department of photonics if you are interested: Elizaveta Semenova or Kresten Yvind

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+[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-System Metal-Oxide(PC1)]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system''
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 *[[/Lesker|Lesker]] - ''Sputter tool''