Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope: Difference between revisions
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Minimizing the reflected power is essential to ensure that the instrument hardware doesn't degrade over time and that the users have accurate information about the processes. Realizing that there may be a challenge with detecting reflected powers we need to decide what to do. We can abandon all processes and start developing new ones - this will halt all processing. Instead, a set of new recipes will be developed. | Minimizing the reflected power is essential to ensure that the instrument hardware doesn't degrade over time and that the users have accurate information about the processes. Realizing that there may be a challenge with detecting reflected powers we need to decide what to do. We can abandon all processes and start developing new ones - this will halt all processing. Instead, a set of new recipes will be developed. | ||
'''Stabilize the pressure''' | |||
Changing the pressure in the plasma has a great impact on the RF matching conditions as illustrated for [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/System-description#Why_RF_matching_is_extremely_important_in_the_Bosch_process | an oxygen plasma]] elsewhere. The obvious place to start is therefore the pressure. Also, it barely makes sense to claim that the pressure is 20 mtorr in the dep phase if it oscillates as shown for the Process D4 above. | Changing the pressure in the plasma has a great impact on the RF matching conditions as illustrated for [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/System-description#Why_RF_matching_is_extremely_important_in_the_Bosch_process | an oxygen plasma]] elsewhere. The obvious place to start is therefore the pressure. Also, it barely makes sense to claim that the pressure is 20 mtorr in the dep phase if it oscillates as shown for the Process D4 above. | ||