Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions
| Line 221: | Line 221: | ||
!QC limits | !QC limits | ||
!Temescal | !Temescal | ||
|- | |||
|Deposition rate deviation | |||
|± 20 % | |||
|- | |- | ||
|Measured average thickness | |Measured average thickness | ||
| | |± 10 % | ||
|- | |- | ||
|Thickness deviation across a 4" wafer | |Thickness deviation across a 4" wafer | ||
|± 5 % | |± 5 % | ||
|- | |- | ||
|} | |} | ||
| Line 235: | Line 235: | ||
|} | |} | ||
Thicknesses are measured in 5 points with one of the Dektak instruments. | Thicknesses are measured in 5 points with one of the Dektak instruments. | ||
Additionally we examine the newly deposited films for particles using the particle scanner (if available, otherwise we use the Jenatech microscope in darkfield mode) and we monitor the sheet resistance of the Ti/Au and Al films. | |||
|} | |} | ||