Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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== Studies of Au deposition processes in the Wordentec== | == Studies of Au deposition processes in the Wordentec== | ||
[[/Roughness of Au|Roughness of Au layers]] - ''Roughness of Au layers deposited | [[/Roughness of Au|Roughness of Au layers]] - ''Roughness of Au layers deposited in the Wordentec'' | ||
===Wafer temperature=== | ===Wafer temperature=== | ||
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The temperatures are accurate within approximately +/- 3C and probably underestimating the actual wafer temperature slightly. It is observed that the wafer temperature increases with each wafer, thus if wafer temperature is of concern it is advised to reduce the number of wafers per run. | The temperatures are accurate within approximately +/- 3C and probably underestimating the actual wafer temperature slightly. It is observed that the wafer temperature increases with each wafer, thus if wafer temperature is of concern it is advised to reduce the number of wafers per run. | ||
== Adhesion of Au on Si == | == Adhesion of Au on Si == | ||