Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions
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It is possible to sputter deposit almost any material, provided that it is possible to deposit with DC | It is possible to sputter deposit almost any material, provided that it is possible to deposit with DC | ||
sputtering. The materials available currently | sputtering. The materials available currently include: | ||
*[[Specific Process Knowledge/Thin film deposition/Deposition of TiW|TiW]] alloy (10%/90% by weight) | *[[Specific Process Knowledge/Thin film deposition/Deposition of TiW|TiW]] alloy (10%/90% by weight) | ||