Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope: Difference between revisions
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Image:PrD4 pico recorded.png | Right: Recorded with the Picoscope | Image:PrD4 pico recorded.png | Right: Recorded with the Picoscope | ||
</gallery> | </gallery> | ||
Comparing to Process A we observe several things: | |||
* The shorter cycle times (Process A has 11 seconds full cycle and Process D4 has 3.2 second full cycle) emphasize the need for the faster process parameter sampling rate. For instance, a dep cycle with one measurement point for the C<sub>4</sub>F<sub>8</sub> flow is no good. | |||
* The oscillations in pressure now last the entire dep cycle - it never stabilizes. | |||
* Optimizing a recipe to arrive at a minimum reflected power, for both coil and platen, using the Pro software datalogging may be somewhat illusory as it doesn't pick up any of the spikes occurring at every change of plasma conditions. | |||