Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope: Difference between revisions
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== Standard process parameter monitoring == | == Standard process parameter monitoring == | ||
The original standard recipes on Pegasus 1 differ in many ways. The second step of | The original standard recipes on Pegasus 1 differ in many ways. Here, we go through two of them. | ||
=== Process A === | |||
The process parameters of the second step of Process A is listed in the table below: | |||
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When running any recipe on the SPTS Pro software, a set of process parameters are recorded as the process runs. This data can be accessed later by looking up the datalog. Which parameters are recorded is dictated by the | When running any recipe on the SPTS Pro software, a set of process parameters are recorded as the process runs. This data can be accessed later by looking up the datalog. Which parameters are recorded is dictated by the so-called logging recipe that is selected for every process recipe. The list of possible parameters to include in a logging recipe is long and is comprised of both input parameters such as 'Coil forward power demand' and 'SF<sub>6</sub> flow setpoint', and measured values such as 'Platen temperature' and 'Platen DC Bias'. During the process itself, one can also activate the 'Trace' to monitor the process parameters in real time. | ||
To the left in the figure below, some of the most important process parameters are shown for a process run of the recipe Process A. | To the left in the figure below, some of the most important process parameters are shown for a process run of the recipe Process A. | ||
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** The reading of the DC Bias has much more detail than the one-point reading of the Pro software indicates. | ** The reading of the DC Bias has much more detail than the one-point reading of the Pro software indicates. | ||
* There are oscillations in the pressure every time whenever there is a change of gas flow | * There are oscillations in the pressure every time whenever there is a change of gas flow | ||
Since Process A is a standard recipe we will not change it as it is. Before deciding what to do we'll have a look at another recipe with shorter cycles. | |||
=== Process D4 === | |||
{| {{table}} | |||
{| border="1" cellspacing="0" cellpadding="1" align="center" | |||
! colspan="3" |[[Specific Process Knowledge/Etch/DRIE-Pegasus/processD#The_new_standard_process_Process_D4 |Process D4 ]] | |||
|- | |||
! Parameter | |||
! Etch | |||
! Dep | |||
|- | |||
! Gas flow (sccm) | |||
| SF<sub>6</sub> 275, O<sub>2</sub> | |||
| C<sub>4</sub>F<sub>8</sub> 150 | |||
|- | |||
! Cycle time (secs) | |||
| 2.2 | |||
| 1 | |||
|- | |||
! Pressure (mtorr) | |||
| 26 | |||
| 20 | |||
|- | |||
! Coil power (W) | |||
| 2500 | |||
| 2000 | |||
|- | |||
! Platen power (W) | |||
| 35 | |||
| 0 | |||
|- | |||
! Common | |||
| colspan="2" | Temperature 0 degs | |||
|- | |||
|} | |||