Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions

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*Wafer thickness
*Wafer thickness
*Depths of larger grooves
*Depths of larger grooves
*Heigth of larger mesas
*Heigth of larger samples
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Thickness resolution  
Thickness resolution  
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*< 5 µm
*< 1 µm
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Substrates
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Batch size
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*One sample
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| style="background:LightGrey; color:black"|Substrate materials allowed
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*No restrictions
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Purpose
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Thickness measurer (wafers)
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*Wafer thickness
*Depths of larger grooves
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Performance
|style="background:LightGrey; color:black"|
Thickness resolution
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*< 1 µm
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|

Revision as of 08:44, 18 March 2020

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Thickness measurer

Thickness Measurer. Positioned in cleanroom D-3

There are 2 thickness measurers in the cleanroom, both positioned in cleanroom D-3. The Thickness measurer is for measuring all sorts of samples. The thickness measurer (wafers) is solely for measuring the thickness of wafers or depths of grooves on wafers.

During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.


The user manual, technical information and contact information can be found in LabManager:

Thickness measurer Thickness measurer (wafers)

Quality Control - Recipe Parameters and Limits

Quality Control (QC) for the Thickness measurer

The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year.

Equipment performance and process related parameters

Purpose

Thickness measurer

  • Wafer thickness
  • Depths of larger grooves
  • Heigth of larger samples

Performance

Thickness resolution

  • < 1 µm

Substrates

Batch size

  • One sample
Substrate materials allowed
  • No restrictions



Purpose

Thickness measurer (wafers)

  • Wafer thickness
  • Depths of larger grooves

Performance

Thickness resolution

  • < 1 µm

Substrates

Batch size

  • One sample
Substrate materials allowed
  • No restrictions