Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions

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 *Wafer thickness
 *Depths of larger grooves
-*Heigth of larger mesas
+*Heigth of larger samples
 |-
 !style="background:silver; color:black" align="center"|
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 Thickness resolution
 |style="background:WhiteSmoke; color:black"|
-*< 5 µm
+*< 1 µm
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|
+Substrates
+|style="background:LightGrey; color:black"|
+Batch size
+|style="background:WhiteSmoke; color:black"|
+*One sample
+|-
+| style="background:LightGrey; color:black"|Substrate materials allowed
+|style="background:WhiteSmoke; color:black"|
+*No restrictions
+|-
+|}
+{| border="2" cellspacing="2" cellpadding="3"
+|-
+!style="background:silver; color:black;" align="center"|
+Purpose
+|style="background:LightGrey; color:black"|
+Thickness measurer (wafers)
+|style="background:WhiteSmoke; color:black"|
+*Wafer thickness
+*Depths of larger grooves
+|-
+!style="background:silver; color:black" align="center"|
+Performance
+|style="background:LightGrey; color:black"|
+Thickness resolution
+|style="background:WhiteSmoke; color:black"|
+*< 1 µm
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="2"|