Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions
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[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness Measurer. Positioned in cleanroom D-3]] | [[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness Measurer. Positioned in cleanroom D-3]] | ||
The | There are 2 thickness measurers in the cleanroom, both positioned in cleanroom D-3. The Thickness measurer is for measuring all sorts of samples. The thickness measurer (wafers) is solely for measuring the thickness of wafers or depths of grooves on wafers. | ||
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching. | During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching. | ||
Revision as of 08:21, 18 March 2020
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Thickness measurer
There are 2 thickness measurers in the cleanroom, both positioned in cleanroom D-3. The Thickness measurer is for measuring all sorts of samples. The thickness measurer (wafers) is solely for measuring the thickness of wafers or depths of grooves on wafers.
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.
The user manual, technical information and contact information can be found in LabManager:
Quality Control - Recipe Parameters and Limits
| Quality Control (QC) for the Thickness measurer |
|
The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year. |
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Purpose |
Thickness measurer |
|
|---|---|---|
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Performance |
Thickness resolution |
|
|
Substrates |
Batch size |
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| Substrate materials allowed |
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