Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 03 processing: Difference between revisions
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At the end of substrate detection, the sample is scanned twice along the bottom edge (flat), in order to determine the substrate rotation. This angle will be presented in the exposure panel along with the option to expose the design rotated in order to compensate for this angle, i.e. aligned to the flat/edge of the substrate. | At the end of substrate detection, the sample is scanned twice along the bottom edge (flat), in order to determine the substrate rotation. This angle will be presented in the exposure panel along with the option to expose the design rotated in order to compensate for this angle, i.e. aligned to the flat/edge of the substrate. | ||
'''Result of using "Expose with substrate angle"''' (Jehem Feb 2020, average of 3 4" wafers) | '''Result of using "Expose with substrate angle":''' (Jehem Feb 2020, average of 3 4" wafers) | ||
*Rotation: 0.05±0.2° | *Rotation: 0.05±0.2° | ||
*Centring: | *Centring: | ||