Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope: Difference between revisions
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{| {{table}} | {| {{table}} | ||
{| border="1" cellspacing="0" cellpadding="1" align="center" | |||
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! colspan="3" |Process A Step 2 parameters | ! colspan="3" |Process A Step 2 parameters | ||
|- | |- | ||
! | ! Parameter | ||
! | ! Etch | ||
! | ! Dep | ||
|- | |- | ||
! Gas flow (sccm) | ! Gas flow (sccm) | ||
Revision as of 12:12, 17 March 2020
Process optimization using the Picoscope
The original standard recipes on Pegasus 1 differ in many ways. The second step of one of them is listed below:
| Process A Step 2 parameters | ||
|---|---|---|
| Parameter | Etch | Dep |
| Gas flow (sccm) | SF6 350 (1.5 s), 550 | C4F8 200 |
| Cycle time (secs) | 7.0 | 4.0 |
| Pressure (mtorr) | 25 (1.5 s), 150 | 25 |
| Coil power (W) | 2800 | 2000 |
| Platen power (W) | 140 (1.5) 45 | 0 |
| Common | Temperature 20 degs | |
- 4 cycles of Process A
-
Recorded with the SPTS software -
Recorded with the Picoscope
- 4 cycles of Process D4
-
Recorded with the SPTS software -
Recorded with the Picoscope
