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Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions

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! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/III-V Dielectric evaporator|III-V Dielectric evaporator]])
|-  
|-  
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
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| Sputter deposition of Ag
| Sputter deposition of Ag
| Sputter deposition of Ag
| Sputter deposition of Ag
| E-beam deposition of Ag
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
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| RF Ar clean  
| RF Ar clean  
| RF Ar clean  
| RF Ar clean  
| 
|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
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|10Å to 2000Å  
|10Å to 2000Å  
|10Å to about 3000Å  
|10Å to about 3000Å  
|10Å to about 1000Å
|10Å to about 1000Å  
|10Å to about 1000Å  
|-
|-
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|Depending on [[/Sputter Ag in Wordentec|process parameters]] (also written in the logbook).
|Depending on [[/Sputter Ag in Wordentec|process parameters]] (also written in the logbook).
|Dependent on process parameters.
|Dependent on process parameters.
|2 Å/s to 5 Å/s
|-
|-


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*1x4" wafers or
*1x4" wafers or
*smaller pieces
*smaller pieces
|
* 2" wafers or
* Smaller pieces


|-style="background:Lightgrey; color:black"
|-style="background:Lightgrey; color:black"
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* SU-8  
* SU-8  
* Metals  
* Metals  
|
* Silicon
* Silicon oxide
* Photoresist


|-style="background:whitesmoke; color:black"
|-style="background:whitesmoke; color:black"
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| Pumpdown approx 10 min.
| Pumpdown approx 10 min.
| Only very thin layers. Pumpdown approx 1 hour.
| Only very thin layers. Pumpdown approx 1 hour.
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|