Specific Process Knowledge/Lithography/DUVStepperLithography: Difference between revisions
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*Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range [[Media:UVN2300.pdf|UVN2300-0.8]]. | *Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range [[Media:UVN2300.pdf|UVN2300-0.8]]. | ||
===Quality Control ( | ===Quality Control (QC)=== | ||
'''THIS SECTION IS UNDER CONSTRUCTION''' [[Image:section under construction.jpg|70px]] | '''THIS SECTION IS UNDER CONSTRUCTION''' [[Image:section under construction.jpg|70px]] | ||