Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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|10Å to 1µm | |10Å to 1µm | ||
|10Å to 0.5µm | |10Å to 0.5µm | ||
|10Å to 0.5µm (not on all wafers) | |10Å to 0.5µm (0.5µm not on all wafers) | ||
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| Deposition rate | | Deposition rate | ||
Revision as of 10:49, 29 January 2009
Silver can be deposited by e-beam or thermal evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | Thermal evaporation (Wordentec) | |
|---|---|---|---|
| Batch size |
|
|
|
| Pre-clean | RF Ar clean | Ar ion bombartment | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 0.5µm | 10Å to 0.5µm (0.5µm not on all wafers) |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 5Å/s | 1Å to 10 Å/s |
Thermal deposition of Silver - Process settings for thermal deposition of Silver in Wordentec