Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
No edit summary |
No edit summary |
||
| Line 30: | Line 30: | ||
[[/Deposition of Silver|Thermal deposition of Silver]] - '' | [[/Deposition of Silver|Thermal deposition of Silver]] - ''Process settings for thermal deposition of Silver in Wordentec'' | ||
Revision as of 09:27, 29 January 2009
Silver can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | |
|---|---|---|
| Batch size |
|
|
| Pre-clean | RF Ar clean | Ar ion bombartment |
| Layer thickness | 10Å to 1µm | 10Å to 0.5µm |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 5Å/s |
Thermal deposition of Silver - Process settings for thermal deposition of Silver in Wordentec