Specific Process Knowledge/Direct Structure Definition: Difference between revisions
| Line 74: | Line 74: | ||
|?? | |?? | ||
|Fluidic devices, optical waveguides, surface modification. | |Fluidic devices, optical waveguides, surface modification. | ||
| | |Fluidic devices, optical waveguides, surface modification. | ||
|Cutting Silicon and glass wafers in odd shapes, shim cutting, shim patterning, surface modification, hole drilling in glass/silicon etc. | |Cutting Silicon and glass wafers in odd shapes, shim cutting, shim patterning, surface modification, hole drilling in glass/silicon etc. | ||
|Cutting Silicon and glass wafers in rectangular shapes, making straight channels in glass wafers. | |Cutting Silicon and glass wafers in rectangular shapes, making straight channels in glass wafers. | ||