Specific Process Knowledge/Direct Structure Definition: Difference between revisions
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| The device is typical made in a thick film (1-10µm thick) of a polymer that is spun on a carrier (silicon wafer). A master with the desired pattern is pressed into this film and the film is hardened by heating or UV-exposure. A residual layer has to be etched away by dry etching. It is possible to form very small 2½D structures over large areas relative fast. | | The device is typical made in a thick film (1-10µm thick) of a polymer that is spun on a carrier (silicon wafer). A master with the desired pattern is pressed into this film and the film is hardened by heating or UV-exposure. A residual layer has to be etched away by dry etching. It is possible to form very small 2½D structures over large areas relative fast. | ||
| The device is typically made in Topas, PP, PE, PS or a similar polymer. A master disk, called a shim, is usually fabricated in nickel or special aluminium alloys with the desired structures to be replicated. It is mounted in the tool of the injection moulding machine. Together they form a cavity into which molten polymer is injected. It is possible to replicate both small and large 2½D structures relatively fast. Many plastic items are made by injection molding, ranging from e.g. toothbrushes to LEGO bricks. | | The device is typically made in Topas, PP, PE, PS or a similar polymer. A master disk, called a shim, is usually fabricated in nickel or special aluminium alloys with the desired structures to be replicated. It is mounted in the tool of the injection moulding machine. Together they form a cavity into which molten polymer is injected. It is possible to replicate both small and large 2½D structures relatively fast. Many plastic items are made by injection molding, ranging from e.g. toothbrushes to LEGO bricks. | ||
| | |The device is typically made using variety of different polymer foils, as well as Graphene. A master pattern, called a shim, is usually fabricated in Si, but can also be fabricated in metals as well as other polymers. It is placed inside the machine between the pressure hot plates, and using a combination of heat and pressure patterned on to the foil. It is possible to replicate both small and large 2½D structures relatively fast. | ||
| The device is made using a series of short, high intensity light pulses to engrave a pattern in almost any material. Since the light pulses are very short (100ns or 10ps) the heating of the sample can be minimized, and material can be removed without any further sample deformation/melting. | | The device is made using a series of short, high intensity light pulses to engrave a pattern in almost any material. Since the light pulses are very short (100ns or 10ps) the heating of the sample can be minimized, and material can be removed without any further sample deformation/melting. | ||
| The dicing saw is mostly used to seperate a silicon/glass wafer into individual chips. It can however also be used to make straight channels in glass/fused silica for e.g. fluidic components. | | The dicing saw is mostly used to seperate a silicon/glass wafer into individual chips. It can however also be used to make straight channels in glass/fused silica for e.g. fluidic components. | ||