Specific Process Knowledge/Back-end processing/Hot Embosser: Difference between revisions

Revision as of 14:52, 25 February 2020

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Name of equipment

Write a short description of the equipment(s).

Image(s) of the equipment(s)

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

RIE1 in LabManager

Process information

Link to process pages - e.g. one page for each material

Example:

Equipment performance and process related parameters

Equipment		Equipment 1	Equipment 2
Purpose		Purpose 1 Purpose 2	Purpose 1 Purpose 2 Purpose 3
Performance	Response 1	Performance range 1 Performance range 2	Performance range 1 Performance range 2 Performance range 3
Performance	Response 2	Performance range	Performance range
Process parameter range	Parameter 1	Range	Range
Process parameter range	Parameter 2	Range	Range
Substrates	Batch size	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers
	Allowed materials	Allowed material 1 Allowed material 2	Allowed material 1 Allowed material 2 Allowed material 3

@@ Line 20: / Line 20: @@
 Example:
-*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2|Etch of silicon using RIE]]
+*
-*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|Etch of silicon oxide using RIE]]
-*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of silicon nitride using RIE]]
-*[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE|Etch of photo resist using RIE]]
 ==Equipment performance and process related parameters==