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Specific Process Knowledge/Thermal Process/Oxidation: Difference between revisions

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Pevo (talk | contribs)
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!
!
[[Specific_Process_Knowledge/Thermal_Process/C3_Anneal-bond_furnace|Anneal Bond furnace (C3)]]
[[Specific_Process_Knowledge/Thermal_Process/C3_Anneal-bond_furnace|Anneal Bond furnace (C3)]]
!
[[Specific_Process_Knowledge/Thermal_Process/Furnace_APOX|APOX furnace (D1)]]
!
!
[[Specific_Process_Knowledge/Thermal_Process/Furnace_Noble|Multipurpose Annealing furnace]]
[[Specific_Process_Knowledge/Thermal_Process/Furnace_Noble|Multipurpose Annealing furnace]]
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|Dry and wet oxidation of 100 mm and 150 mm wafers. Oxidation of new wafers without RCA cleaning. Oxidation and annealing of wafers from the LPCVD furnaces and PECVD4.  
|Dry and wet oxidation of 100 mm and 150 mm wafers. Oxidation of new wafers without RCA cleaning. Oxidation and annealing of wafers from the LPCVD furnaces and PECVD4.  
|Dry and wet oxidation and annealing of wafers from Wafer Bonder 02 and from PECVD4 and PECVD3.
|Dry and wet oxidation and annealing of wafers from Wafer Bonder 02 and from PECVD4 and PECVD3.
|Wet oxidation of very thick oxides > 4 µm.
|Dry oxidation and annealing of almost all materials.
|Dry oxidation and annealing of almost all materials.
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*Dry: O<sub>2</sub>
*Dry: O<sub>2</sub>
*Wet: Bubbler
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*Wet: Bubbler  
*Wet: Bubbler  
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Annealing gas
!Annealing gas
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*N<sub>2</sub>
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*N<sub>2</sub>
*N<sub>2</sub>
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*900 <sup>o</sup>C - 1150 <sup>o</sup>C
*900 <sup>o</sup>C - 1150 <sup>o</sup>C
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*1075 <sup>o</sup>C
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*Vacuum: 20 <sup>o</sup>C - 1050 <sup>o</sup>C
*Vacuum: 20 <sup>o</sup>C - 1050 <sup>o</sup>C
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*1-30 50 mm wafers
*1-30 50 mm wafers
*1-30 100 mm wafers
*1-30 100 mm wafers
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*1-150 100 mm wafers
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*1-30 50 mm, 100 mm or 150 mm wafers  
*1-30 50 mm, 100 mm or 150 mm wafers  
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*All processed wafers have to be RCA cleaned, except for wafers from Wafer Bonder 02 and from PECVD4 and PECVD3.
*All processed wafers have to be RCA cleaned, except for wafers from Wafer Bonder 02 and from PECVD4 and PECVD3.
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*Only new wafers
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*Depends on the furnace quartz set:
*Depends on the furnace quartz set: