Specific Process Knowledge/Thermal Process/Oxidation: Difference between revisions
Appearance
| Line 56: | Line 56: | ||
! | ! | ||
[[Specific_Process_Knowledge/Thermal_Process/C3_Anneal-bond_furnace|Anneal Bond furnace (C3)]] | [[Specific_Process_Knowledge/Thermal_Process/C3_Anneal-bond_furnace|Anneal Bond furnace (C3)]] | ||
! | ! | ||
[[Specific_Process_Knowledge/Thermal_Process/Furnace_Noble|Multipurpose Annealing furnace]] | [[Specific_Process_Knowledge/Thermal_Process/Furnace_Noble|Multipurpose Annealing furnace]] | ||
| Line 70: | Line 68: | ||
|Dry and wet oxidation of 100 mm and 150 mm wafers. Oxidation of new wafers without RCA cleaning. Oxidation and annealing of wafers from the LPCVD furnaces and PECVD4. | |Dry and wet oxidation of 100 mm and 150 mm wafers. Oxidation of new wafers without RCA cleaning. Oxidation and annealing of wafers from the LPCVD furnaces and PECVD4. | ||
|Dry and wet oxidation and annealing of wafers from Wafer Bonder 02 and from PECVD4 and PECVD3. | |Dry and wet oxidation and annealing of wafers from Wafer Bonder 02 and from PECVD4 and PECVD3. | ||
|Dry oxidation and annealing of almost all materials. | |Dry oxidation and annealing of almost all materials. | ||
|- | |- | ||
| Line 90: | Line 87: | ||
| | | | ||
*Dry: O<sub>2</sub> | *Dry: O<sub>2</sub> | ||
*Wet: Bubbler | *Wet: Bubbler | ||
| | | | ||
| Line 100: | Line 95: | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Annealing gas | !Annealing gas | ||
| | | | ||
*N<sub>2</sub> | *N<sub>2</sub> | ||
| Line 130: | Line 123: | ||
| | | | ||
*900 <sup>o</sup>C - 1150 <sup>o</sup>C | *900 <sup>o</sup>C - 1150 <sup>o</sup>C | ||
| | | | ||
*Vacuum: 20 <sup>o</sup>C - 1050 <sup>o</sup>C | *Vacuum: 20 <sup>o</sup>C - 1050 <sup>o</sup>C | ||
| Line 158: | Line 149: | ||
*1-30 50 mm wafers | *1-30 50 mm wafers | ||
*1-30 100 mm wafers | *1-30 100 mm wafers | ||
| | | | ||
*1-30 50 mm, 100 mm or 150 mm wafers | *1-30 50 mm, 100 mm or 150 mm wafers | ||
| Line 179: | Line 168: | ||
| | | | ||
*All processed wafers have to be RCA cleaned, except for wafers from Wafer Bonder 02 and from PECVD4 and PECVD3. | *All processed wafers have to be RCA cleaned, except for wafers from Wafer Bonder 02 and from PECVD4 and PECVD3. | ||
| | | | ||
*Depends on the furnace quartz set: | *Depends on the furnace quartz set: | ||