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Specific Process Knowledge/Etch/III-V RIE/III V RIE ETCHES: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,318 edits
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{| border="1" style="text-align: center; width: 600px; height: 350px;"
{| border="1" style="text-align: center; width: 600px; height: 350px;"
! colspan="7" style="text-align: center;" style="background: #efefef;" | CHF<sub>3</sub>/O<sub>2</sub> etch rates, nm/min
! colspan="8" style="text-align: center;" style="background: #efefef;" | CHF<sub>3</sub>/O<sub>2</sub> etch rates, nm/min
|-
|-
! scope="row" width="15%" |Process Name
! scope="row" width="15%" |Process Name
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! width="10%" |ZEP520A
! width="10%" |ZEP520A
! width="10%" |Negative DUV: UVN 2030-0.5
! width="10%" |Negative DUV: UVN 2030-0.5
! width="40%" |Comments/links
|-
|-
!SiO2_602  
!SiO2_602  
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|29'''<sup>{(2)}</sup>'''
|29'''<sup>{(2)}</sup>'''
|36'''<sup>{(3)}</sup>'''
|36'''<sup>{(3)}</sup>'''
|&nbsp;
|&nbsp;
|&nbsp;
|-
|-
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|&nbsp;
|&nbsp;
|10.6
|10.6
|&nbsp;
|-
|-
!Lower etch rate, medium selectivity to resist
!Lower etch rate, medium selectivity to resist
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|&nbsp;
|&nbsp;
|~12
|~12
|&nbsp;
|&nbsp;
|&nbsp;
|-
|-
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|38
|38
|&nbsp;
|&nbsp;
|&nbsp;
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|&nbsp;
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