Specific Process Knowledge/Thermal Process/C3 Anneal-bond furnace: Difference between revisions
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|style="background:LightGrey; color:black"|Substrate materials allowed | |style="background:LightGrey; color:black"|Substrate materials allowed | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Silicon wafers | *Silicon wafers | ||
*Silicon wafers with layers of silicon oxide or silicon | *Silicon wafers with layers of silicon oxide or silicon nitride | ||
*Wafers from the LPCVD furnaces | *Wafers from the LPCVD furnaces | ||
*Wafers from PECVD4 | *Wafers from PECVD4 | ||