Specific Process Knowledge/Characterization/Profiler

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Dektak XTA stylus profiler

The Dektak XTA stylus profiler from Brüker is usable for profiling surfaces of samples with structures in the micro- and nanometer range. However, the size of the structures that can be measured is limited by the tip dimensions.

A profil measurement can be done in a specific point by using a high magnification camera to locate the structure. It is also possible to program the stylus to measure in several positions, defined with respect to some deskew points. Stress measurements of thin films can be done by measuring the wafer bow.

The user manual(s), quality control procedure(s) and results, technical information and contact information can be found in LabManager:

Dektak XTA in LabManager

Equipment performance and process related parameters Dektak XTA

Dektak XTA: positioned in cleanroom F-2.

Purpose	Profiler for measuring micro structures	Single line profiles Wafer mapping Stress measurements by measuring wafer bow Surface roughness on a line scan
Performance	Scan range x y	Line scan x: 50 µm to 55 mm in a single scan, up to 200 mm with stiching
	Scan range z	50 Å to 1 mm
	Resolution x y	Down to 0.003 µm
	Resolution z	1 Å, 10 Å, 80 Å or 160 Å (for ranges 65 kÅ, 655 kÅ, 5240 kÅ and 1 mm respectively)
	Max scan depth as a function of trench width W	1.2*(W[µm]-5µm)
Hardware settings	Tip radius	5 µm 45o cone
Substrates	Substrate size	Up to 6"
	Substrate materials allowed	In principle all materials

Dektak 8 stylus profiler

Dektak 8: positioned in cleanroom F-2.

Dektak 8 stylus profiler is a product of Veeco Instruments. It is usable for profiling surfaces of samples with structures in the micro- and nanometer range. However, the size of the structures that can be measured is limited by the tip dimensions. It can measure in a specific point found with help from high magnification video cameras or it can be programmed to measure several points defined with respect to some deskew points. It can also be used for stress measurements of thin films by measuring the wafer bow.

To get some product information and some tips and tricks from the vendor take a look at Veeco's homepage [1]

The user manual(s), quality control procedure(s) and results, technical information and contact information can be found in LabManager:

Dektak 8 in LabManager

Equipment performance and process related parameters Dektak 8 stylus profiler

Purpose	Profiler for measuring micro structures.	Single line profiles Wafer mapping Stress measurements by measuring wafer bow Surface roughness on a line scan
Performance	Scan range x y	Line scan x: 50 µm to 100 mm
	Scan range z	50 Å to 1 mm
	Resolution x y	Down to 0.067 µm
	Resolution z	1 Å, 10 Å, 4 0Å or 160 Å (for ranges 65 kÅ, 655 kÅ, 2620 kÅ and 1 mm respectively)
	Max. scan depth as a function of trench width W	1.2*(W[µm]-5µm)
Hardware settings	Tip radius	5 µm, 45o cone
Performance	Substrate size	Up to 8"
	Substrate material allowed	In principle all materials

Optical Profiler (Sensofar)

Optical Profiler (Sensofar): positioned in the clean room F-2)

The PLu Neox 3D Optical Profiler (from Sensofar) has a dual-technology sensor head that combines confocal and interferometry techniques as well as thick and thin film measurement capabilities.

The Neox sensor head provides standard microscope imaging, confocal imaging, confocal profiling, PSI (Phase Shift Interferometry), VSI (Vertical Scanning Interferometry) and high resolution thin film thickness measurements on a single instrument.

The main purpose is 3D topographic imaging of surfaces, step height measurements in smaller trenches/holes than can be obtained with standard stylus methods (i.e. with aspect ratios higher that 1:1), roughness measurements with larger FOV (Field Of View) than the AFM, but less horisontal resolution.

For most samples the optical profiler provides fast and easy information without any sample preparation. However, it can be necessary to cover thin transparent layers (< 2 µm) with a thin layer of metal.

The resolution is limited by the objectives and the pixel resolution. Also the depth of focus is limited, especially for higher magnifications.

The user manual, technical information and contact information can be found in LabManager:

Optical profiler (Sensofar) info page in LabManager

Process Information

• Results from the Optical Profiler (Sensofar) acceptance test

Equipment performance and process related parameters

Equipment		Optical profiler
Purpose	3D topographic imaging of surfaces.	3D imaging of surfaces Roughness measurements Step height measurements 3D topographic measurements Thick and thin film thickness measurements in small spots (down to 4 µm)
Posibilities	Confocal and interferometric profiling and reflectometry	Standard microscope imaging Confocal imaging Confocal profiling PSI (Phase Shift Interferometry) VSI (Vertical Scanning Interferometry) High resolution thin film thickness measurement using reflectrometry Stitched scans Wafer mapping
Performance	Depending on the objective chosen	See the performance of the different objectives here:
Substrates	Substrate size	Substrates no bigger than 150 mm x 150mm
	Substrate materials allowed	In principle all materials

Optical Profiler (Filmetrics)

Optical Profiler (Sensofar): positioned in the basement (346-904)

The Profilm3D optical profiler from Filmetrics uses white-light-interferometry (WLI) and phase-shifting-interferometry (PSI) to produce surface profiles and depth-of-field color images.

The main purpose is 3D topographic imaging of surfaces, step height measurements and roughness measurements with larger FOV (Field Of View) than the AFM, but less horisontal resolution.

For most samples the optical profiler provides fast and easy information without any sample preparation. However, it can be necessary to cover thin transparent layers (< 2 µm) with a thin layer of metal.

The resolution is limited by the objective and the sampling resolution.

The user manual, technical information and contact information can be found in LabManager:

Optical profiler (Filmetrics) info page in LabManager

Equipment performance and process related parameters

Equipment		Optical profiler
Purpose	3D topographic imaging of surfaces.	3D imaging of surfaces Roughness measurements Step height measurements 3D topographic measurements
Posibilities	Interferometric profiling	Standard microscope imaging PSI (Phase Shift Interferometry) WLI (White light Interferometry) Stitched scans Wafer mapping
Performance	With the current 10x objective	See here the data sheet for this instrument
Substrates	Substrate size	Substrates no bigger than 100 mm x 100mm
	Substrate materials allowed	In principle all materials

Dektak 3ST

The profiler placed in 346-904 (Dektak 3ST).

The Dektak 3ST is intended for profile measurements on sample outside the cleanroom.

The user manual, technical information and contact information can be found in LabManager:

Dektak 3ST (Dektak) in LabManager

The computer connected to the Dektak 3ST is pretty old and runs Windows 98 SE. It is not connected to the network but traces can be saved on either USB memory stick or floppy disk. The USB driver is an old universal driver and has been shown to work with small size USB sticks. However it did not work with an 8GB Kingston stick.

Equipment performance and process related parameters

Performance	Vertical Range	65 kÅ, 655 kÅ, 1310 kÅ
	Scan length range	50-50000 µm
	Stylus track force	Recommended: 3-10 mg, depending on the softness of the surface
	Scan speed ranges	High speed: 3s for 50µm to 50000µm Medium speed: 12s for 50µm to 10000µm Low speed: 50s
Materials	Allowed substrate materials	III-V Silicon polymer

Stylus Profiler: Dektak150

Stylus profiler:Dektak150 placed in 347-183.

The stylus profiler Dektak150 is intended for profile measurements on samples outside the cleanroom.

The user manual, technical information and contact information can be found in LabManager:

Sylus profiler:Dektak150 in LabManager

The computer is not connected to the network but data can be saved on a dedicated USB and transfered to a computer on the network.

Equipment performance and process related parameters

Purpose	Profiler for measuring micro structures	Single line profiles Surface roughness on a line scan
Performance	Scan range x y	Line scan x: 50 µm to 55 mm in a single scan
	Scan range z	50 Å to 1 mm
	Resolution x y	Down to 0.003µm
	Resolution z	1Å (@65kÅ), 10Å (@655 kÅ), 80 Å (@5240 kÅ), 160 Å (@1mm)
	Maximum sample thickness	100mm
Hardware settings	Tip radius	5 µm 45o cone 0.2 µm 45o cone on request
Substrates	Substrate size	Up to 6"
	Substrate materials allowed	In principle all materials

Comparing the profilers

Take a look at the topographic measurement page.