Specific Process Knowledge/Direct Structure Definition: Difference between revisions
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|medium: 5-10 wafers/hour depending on exposure time | |medium: 5-10 wafers/hour depending on exposure time | ||
|medium: 5-10 wafers/hour depending on imprint time | |medium: 5-10 wafers/hour depending on imprint time | ||
| | |Fast: Typically 10-300 samples/hour | ||
|medium-slow: 0.1-1 wafers/hour depending on pattern complexity | |medium-slow: 0.1-1 wafers/hour depending on pattern complexity | ||
|medium: ½-3 wafers/hour depending on material and # of cuts (Si cuts at 5mm/s, SiO2 at 0.5-1 mm/s) | |medium: ½-3 wafers/hour depending on material and # of cuts (Si cuts at 5mm/s, SiO2 at 0.5-1 mm/s) | ||