Specific Process Knowledge/Lithography/Pretreatment: Difference between revisions
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|style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven: HMDS 2|Oven: HMDS 2]]</b> | |style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven: HMDS 2|Oven: HMDS 2]]</b> | ||
|style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Gamma UV]]</b> | |style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV|Gamma UV]]</b> | ||
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* HMDS priming only | * HMDS priming only | ||
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* HMDS priming only | * HMDS priming only | ||
* HMDS priming and spin coating | * HMDS priming and spin coating | ||
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Fast recipe [standard recipe]: | Fast recipe [standard recipe]: | ||
* Si (native oxide): 72.9° [81.0°] | * Si (native oxide): 72.9° [81.0°] | ||
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150°C | 150°C | ||
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120°C | 120°C | ||
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25 minutes | 25 minutes | ||
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1 min / wafer | 1 min / wafer | ||
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* 150 mm wafers | * 150 mm wafers | ||
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* 50 mm wafers (tool change required) | * 50 mm wafers (tool change required) | ||
* 100 mm wafers | * 100 mm wafers | ||
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Silicon and glass wafers | Silicon and glass wafers | ||
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1 - 25, multiple batches possible | 1 - 25, multiple batches possible | ||
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1 - 25 | 1 - 25 | ||
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